Performance stability of high-power III-nitride metal-oxide semiconductor-heterostructure field-effect transistors      
Yazarlar (9)
Prof. Dr. Salih SAYGI Tokat Gaziosmanpaşa Üniversitesi, Türkiye
Fatima Hamadi
He Xi
Rai Sheva
Koudymov Alexei
Adivarahan Vinod
Yang J W
Simin Grigory
Khan M Asif
Makale Türü Özgün Makale
Makale Alt Türü SSCI, AHCI, SCI, SCI-Exp dergilerinde yayınlanan tam makale
Dergi Adı physica status solidi (c)
Dergi ISSN 1610-1634
Dergi Tarandığı Indeksler SCI
Dergi Grubu Q4
Makale Dili İngilizce
Basım Tarihi 05-2005
Cilt No 2
Sayı 7
Sayfalar 2651 / 2654
DOI Numarası 10.1002/pssc.200461520
Özet
Record high RF power densities up to 30 W/mm have been recently achieved using AlGaN/GaN Heterostructure Field-Effect Transistors (HFETs). These results exhibit the promise of III-Nitride HFETs for high-power microwave applications. However the output RF power of these devices was found to degrade with the operation time. Gate leakage current in conventional HFETs is a major contributor to device instability and failure. We previously reported on the development of Metal-Oxide-Semiconductor Insulated gate HFETs (MOSHFETs) with gate leakage currents four to six orders of magnitude lower than those of the HFETs. The MOSHFETs has demonstrated a significant performance improvement as compared to conventional HFETs resulting in higher channel currents and RF powers. In this study, we present the first comparative experimental evaluation of the HFET and MOSHFET lifetime at room and elevated temperatures. The room temperature HFET stability lifetime as high as 2.4 years is estimated. We also present the detailed study of the HFETs stabilization and failure mechanisms. The pronounced similarity of the mechanisms of device degradation and current collapse is demonstrated. © 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
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